Inelastic strain analysis of solder joint in NASA fatigue specimen

An edition of Inelastic strain analysis of solder joint in NASA fatigue specimen (1991)

Inelastic strain analysis of solder joint in NASA fatigue specimen

final report

By Abhijit Dasgupta

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Publish Date

1991

Publisher

University of Maryland,NASA Goddard Space Flight Center

Language

eng

Pages

Description:

subjects: Thermal cycling tests, Elastic properties, Solder and soldering, Creep analysis, Fatigue (Materials), Viscoplasticity, Finite element method, Solders, Strains and stresses, Plastic properties, Fatigue life