Adhesives technology for electronic applications

materials, processing, reliability

By James J. Licari

0 (0 Ratings)

0 Want to read0 Currently reading0 Have read

Publish Date

2011

Publisher

William Andrew Pub.

Language

eng

Pages

403

Description:

subjects: Adhesives, Electronics, Materials, Electronic packaging, Électronique, Matériaux, Adhésifs, Mise sous boîtier (Électronique), Adhesive