An edition of Power Electronic Packaging (2012)
Power Electronic Packaging
Design, Assembly Process, Reliability and Modeling
By Liu, Yong
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Publish Date
2012
Publisher
Springer US
Language
eng
Pages
612
Description:
subjects: Systems engineering, Circuits and Systems, Spectroscopy and Microscopy, Instrumentation Electronics and Microelectronics, Solid state physics, Production of electric energy or power, Electrical Machines and Networks Power Electronics, Electronics, Engineering, Electronic packaging, Power electronics, Science