An edition of The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages (1999)
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
By Gerard Kelly
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Publish Date
Oct 08, 2011
Publisher
Springer
Language
-
Pages
147
1-2 of 2 Editions
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Pages: 160
Published In: Oct 08, 2011
Publisher: Springer
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Language: eng
Pages: 134
Published In: 1999
Publisher: Springer US