An edition of Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (2015)
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-Free Solder Joint Interfaces
By Qingke Zhang
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Publish Date
2015
Publisher
Springer London, Limited
Language
eng
Pages
151
Description:
subjects: Joints (engineering)