An edition of Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (2017)
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
By Jie Cheng
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Publish Date
Jan 30, 2019
Publisher
Springer
Language
-
Pages
146
Description:
subjects: Ruthenium, Grinding and polishing, Integrated circuits