An edition of Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices (2020)
Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
By Ephraim Suhir
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Publish Date
2021
Publisher
Taylor & Francis Group,CRC Press
Language
eng
Pages
344
Description:
subjects: Interconnects (Integrated circuit technology), Protection, Solder and soldering, Mechanical properties, Mathematical models, Failure analysis (Engineering), Equipment Failure Analysis, Interconnexions (Technologie des circuits intégrés), Soudure, Propriétés mécaniques, Modèles mathématiques, Analyse des défaillances (Ingénierie), TECHNOLOGY, Electronics, General, Material Science