An edition of Three-dimensional molded interconnect devices (3D-MID) (2014)
Three-dimensional molded interconnect devices (3D-MID)
materials, manufacturing, assembly, and applications for injection molded circuit carriers
By Franke, Jörg Dipl.-Ing
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Publish Date
2014
Publisher
Hanser Publishers,Hanser Publications
Language
eng
Pages
356
Description:
subjects: Interconnects (Integrated circuit technology), Design and construction, Injection molding of plastics, Integrated circuits, Plastics, molding, Matières plastiques, Moulage par injection, Injection molding, TECHNOLOGY & ENGINEERING, Mechanical, Electrical & Computer Engineering, Engineering & Applied Sciences, Electrical Engineering