An edition of Fatigue life prediction of solder joints in electronic packages with ANSYS (2002)

Fatigue life prediction of solder joints in electronic packages with ANSYS

By Erdogan Madenci

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Publish Date

2002

Publisher

Kluwer Academic Publishers

Language

eng

Pages

185

Description:

subjects: ANSYS (Computer system), Computer-aided design, Electronic packaging, Fatigue, Forecasting, Metals, Quality control, Service life (Engineering), Solder and soldering, Metals, fatigue