An edition of Reflow soldering processes and troubleshooting (2002)
Reflow soldering processes and troubleshooting
SMT, BGA, CSP and flip chip technologies
By Ning-Cheng Lee
Publish Date
2002
Publisher
Newnes
Language
eng
Pages
270
Description:
subjects: Design and construction, Electric connectors, Electronic apparatus and appliances, Electronic packaging, Solder and soldering, TECHNOLOGY & ENGINEERING, Microelectronics, Digital, Electronics, Integrated circuits, Manufacturing, Industrial technology, General, Chemical & biochemical, Professional, career & trade -> electronics -> general, Trades & technology -> industrial technology -> manufacturing, Trades & technology -> industrial technology -> industrial technology, Professional, career & trade -> engineering -> chemical engineering