Explore Books on
ball grid array technology

Area Array Packaging Handbook

By Ken Gilleo

Twenty second IEEE/CPMT International Electronics Manufacturing Technology Symposium

By IEEE/CPMT International Electronics Manufacturing Technology Symposium (22nd 1998 Berlin, Germany),Institute of Electrical and Electronics Engineers,Germany) CPMT International Electronics Manufacturing Technology Symposium (22nd : 1998 : Berlin

Area Array Packaging Materials

By Ken Gilleo

Twenty third IEEE/CPMT International Electronics Manufacturing Technology Symposium

By IEEE/CPMT International Electronics Manufacturing Technology Symposium (23rd 1998 Austin, Tex.),Institute of Electrical and Electronics Engineers,Tex.) CPMT International Electronics Manufacturing Technology Symposium (23rd : 1998 : Austin

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium

By IEEE/CPMT International Electronics Manufacturing Technology Symposium (26th 2000 Santa Clara, California),Institute of Electrical and Electronics Engineers,Calif.) CPMT International Electronics Manufacturing Technology Symposium (26th : 2000 : Santa Clara

ITherm 2002

By InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (8th 2002 San Diego, Calif.)

ITherm 2000

By InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (7th 2000 Las Vegas, Nev.)

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium

By IEEE/CPMT International Electronics Manufacturing Technology Symposium (24th 1999 Austin, Tex.)

I-THERM V

By InterSociety Conference on Thermal Phenomena in Electronic Systems (5th 1996 Orlando, Fla.)

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium

By IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (28th 2003 San Jose, Calif.)

Intersociety Conference on Thermal Phenomena in Electronic Systems: I-Therm V : Proceedings 1996

By Institute of Electrical and Electronics Engineers

Thermal Phenomena in Electronic Systems (I-THERM), 1998 Intersociety Conference

By Institute of Electrical and Electronics Engineers

Electronics Manufacturing Technology (Iemt), 2000 Ieee/Cpmt 24th

By IEMT

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium

By IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (29th 2004 San Jose, Calif.)

Itherm 2000

By Nev.) InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (7th : 2000 : Las Vegas

Impact of reworking ceramic area array packages on the integrity of the printed board laminate

By P. E. Tegehall

Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages

By P. E. Tegehall

Evaluation of a process for the repair of area array and other surface mounted packages

By J. Schon̈beck

ITherm'98

By InterSociety Conference on Thermal Phenomena in Electronic Systems (6th 1998 Seattle, Washington)

An investigation into ball grid array inspection techniques

By

Ball Grid Array Technology

By John H. Lau