Impact of reworking ceramic area array packages on the integrity of the printed board laminate

An edition of Impact of reworking ceramic area array packages on the integrity of the printed board laminate (2005)

Impact of reworking ceramic area array packages on the integrity of the printed board laminate

By P. E. Tegehall

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Publish Date

2005

Publisher

ESA Publications Division, ESTEC

Language

eng

Pages

Description:

subjects: Ball grid array technology, TERMINOLOGY, RELIABILITY ENGINEERING, ARRAYS, TECHNOLOGIES, RELIABILITY