Explore Books on
junctions

1-24 of 136 Books

Cover of Internal Photoemission Spectroscopy by valeri v. afanas'ev

Internal Photoemission Spectroscopy

By Valeri V. Afanas'ev

Cover of MOS Interface Physics Process and Characterization by shengkai wang,xiaolei wang

MOS Interface Physics Process and Characterization

By Shengkai Wang,Xiaolei Wang

Cover of Advances in research and development by maurice h. francombe,john l. vossen

Advances in research and development

By Maurice H. Francombe,John L. Vossen

Cover of A priori Wire Length Estimates for Digital Design by dirk stroobandt

A priori Wire Length Estimates for Digital Design

By Dirk Stroobandt

Cover of Handbook of semiconductor interconnection technology by geraldine cogin shwartz,geraldine c. schwartz,kris v. srikrishnan

Handbook of semiconductor interconnection technology

By Geraldine Cogin Shwartz,Geraldine C. Schwartz,Kris V. Srikrishnan

Cover of Semiconductor surfaces and interfaces by winfried mönch

Semiconductor surfaces and interfaces

By Winfried Mönch

Cover of Superconductor/Semiconductor Junctions by thomas schäpers

Superconductor/Semiconductor Junctions

By Thomas Schäpers

Cover of Tunnelling and negative resistance phenomena in semiconductors by d. k. roy

Tunnelling and negative resistance phenomena in semiconductors

By D. K. Roy

Control of semiconductor interfaces

Control of semiconductor interfaces

By International Symposium on Control of Semiconductor Interfaces (1st 1993 Karuizawa, Japan),I. Ohdomari,M. Oshima

Cover of Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics--2004 by r. j. carter

Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics--2004

By R. J. Carter

Materials, technology and reliability of low-k dielectrics and copper interconnects

Materials, technology and reliability of low-k dielectrics and copper interconnects

By Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.)

Cover of Interconnect analysis and synthesis by chung-kuan cheng,john lillis,shen lin,norman chang

Interconnect analysis and synthesis

By Chung-Kuan Cheng,John Lillis,Shen Lin,Norman Chang

Cover of Copper-fundamental mechanisms for microelectronic applications by s. p murarka,shyam p. murarka,igor v. verner,ronald j. gutmann

Copper-fundamental mechanisms for microelectronic applications

By S. P Murarka,Shyam P. Murarka,Igor V. Verner,Ronald J. Gutmann

Cover of Thin films by maurice h. francombe

Thin films

By Maurice H. Francombe

Cover of Solid state devices by donard de cogan

Solid state devices

By Donard De Cogan

Cover of High-speed VLSI interconnections by ashok k. goel

High-speed VLSI interconnections

By Ashok K. Goel

Cover of Epioptics by d. l. weaire

Epioptics

By D. L. Weaire

Cover of Contacts to semiconductors by leonard j. brillson

Contacts to semiconductors

By Leonard J. Brillson

Cover of Materials, technology and reliability for advanced interconnects--2005 by paul r. besser,c. p. wong

Materials, technology and reliability for advanced interconnects--2005

By Paul R. Besser,C. P. Wong

Cover of Materials, technology and reliability for advanced interconnects and low-k dielectrics by karen maex

Materials, technology and reliability for advanced interconnects and low-k dielectrics

By Karen Maex

Cover of Silicon heterojunction solar cells by w. r. fahrner,m. muehlbauer,h. c. neitzert

Silicon heterojunction solar cells

By W. R. Fahrner,M. Muehlbauer,H. C. Neitzert

Cover of Microvias by john h. lau,s.w. ricky lee

Microvias

By John H. Lau,S.W. Ricky Lee

Cover of Lasers, junctions, transport / edited by R.K. Willardson, Albert C. Beer by r. k. willardson,albert c. beer

Lasers, junctions, transport / edited by R.K. Willardson, Albert C. Beer

By R. K. Willardson,Albert C. Beer

Modeling and simulation of high speed VLSI interconnects

Modeling and simulation of high speed VLSI interconnects

By Q. J. Zhang