Materials, technology and reliability of low-k dielectrics and copper interconnects
An edition of Materials, technology and reliability of low-k dielectrics and copper interconnects (2006)
symposium held April 18-21, 2006, San Francisco, California, U.S.A.
By Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.)
Publish Date
2006
Publisher
Materials Research Society
Language
eng
Pages
462
Description:
subjects: Congresses, Materials, Integrated circuits, Semiconductors, Reliability, Dielectric films, Junctions