Novel three-dimensional vertical interconnect technology for microwave and RF applications
An edition of Novel three-dimensional vertical interconnect technology for microwave and RF applications (1999)
By Kavita Goverdhanam
Publish Date
1999
Publisher
National Aeronautics and Space Administration, Glenn Research Center,National Technical Information Service, distributor
Language
eng
Pages
-
Description:
subjects: Radio frequencies, Integrated circuits, Microwave circuits