Novel three-dimensional vertical interconnect technology for microwave and RF applications

An edition of Novel three-dimensional vertical interconnect technology for microwave and RF applications (1999)

Novel three-dimensional vertical interconnect technology for microwave and RF applications

By Kavita Goverdhanam

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Publish Date

1999

Publisher

National Aeronautics and Space Administration, Glenn Research Center,National Technical Information Service, distributor

Language

eng

Pages

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