Materials, technology and reliability of low-k dielectrics and copper interconnects
An edition of Materials, technology and reliability of low-k dielectrics and copper interconnects (2006)
symposium held April 18-21, 2006, San Francisco, California, U.S.A.
By Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.)
Publish Date
2006
Publisher
Materials Research Society
Language
eng
Pages
462
1-3 of 3 Editions
Materials, technology and reliability of low-k dielectrics and copper interconnects
Language: eng
Pages: 462
Published In: 2006
Publisher: Materials Research Society
Materials, technology and reliability of low-k dielectrics and copper interconnects
Language: eng
Pages: 462
Published In: 2006
Publisher: Materials Research Society
Materials, technology and reliability of low-k dielectrics and copper interconnects
Language: eng
Pages: 462
Published In: 2006
Publisher: Materials Research Society