An edition of Thin film materials, processes, and reliability (2003)
Thin film materials, processes, and reliability
plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium
By International Symposium on Thin Film Materials, Processes, and Reliability (2003 Paris, France),G. Mathad,T. Cale,H. Rathore
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Publish Date
2003
Publisher
Electrochemical Society
Language
eng
Pages
424
1-2 of 2 Editions
Thin Film Materials, Processes, and Reliability
Published In: September 2003
Publisher: Electrochemical Society
Thin film materials, processes, and reliabilityplasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium
Language: eng
Pages: 424
Published In: 2003
Publisher: Electrochemical Society