An edition of Thin film materials, processes, and reliability (2003)

Thin film materials, processes, and reliability

plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium

By International Symposium on Thin Film Materials, Processes, and Reliability (2003 Paris, France),G. Mathad,T. Cale,H. Rathore