An edition of Electromigration in thin films and electronic devices (2011)
materials and reliability
By Choong-Un Kim
Publish Date
2011
Publisher
Woodhead Publishing
Language
eng
Pages
352
Description:
subjects: Electrodiffusion, Integrated circuits, Deterioration, Thin films, Interconnects (Integrated circuit technology), Diffusion, Couches minces, TECHNOLOGY & ENGINEERING, Mechanical