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Cover of Microvias

Microvias

For Low Cost, High Density Interconnects

By John H. Lau,S.W. Ricky Lee

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Publish Date

April 26, 2001

Publisher

McGraw-Hill Professional

Language

eng

Pages

565

1-2 of 2 Editions

Cover of MicroviasView Microvias
MicroviasFor Low Cost, High Density Interconnects

Language: eng

Pages: 565

Published In: April 26, 2001

Publisher: McGraw-Hill Professional

Cover of MicroviasView Microvias
MicroviasFor Low Cost, High Density Interconnects

Language: eng

Pages: 565

Published In: April 26, 2001

Publisher: McGraw-Hill Professional