Cover of Microvias

An edition of Microvias (2001)

Microvias

For Low Cost, High Density Interconnects

By John H. Lau,S.W. Ricky Lee

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Publish Date

April 26, 2001

Publisher

McGraw-Hill Professional

Language

eng

Pages

565

Description:

subjects: Integrated circuits, Junctions, Semiconductors, Printed circuits, Cost control, Microelectronic packaging, Design and construction, Electric circuits, Electric engineering