Introduction to microsystem packaging technology

An edition of Introduction to microsystem packaging technology (2010)

Introduction to Microsystem Packaging Technology

By Yufeng Jin

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Publish Date

2010

Publisher

Taylor & Francis Group

Language

eng

Pages

232

Description:

subjects: Microelectronic packaging, Electronic packaging, Mise sous boîtier (Microélectronique), TECHNOLOGY & ENGINEERING, Electronics, Digital, Microelectronics