Explore Books on
microelectronic packaging

1-24 of 188 Books

Introduction to microsystem packaging technology

Introduction to microsystem packaging technology

By Yufeng Jin

Cover of Semiconductor packaging by andrea chen

Semiconductor packaging

By Andrea Chen

Cover of MEMS and Microsystems by tai-ran hsu

MEMS and Microsystems

By Tai-Ran Hsu

Cover of Mems by vikas choudhary,krzysztof iniewski

Mems

By Vikas Choudhary,Krzysztof Iniewski

LCP for microwave packages and modules

LCP for microwave packages and modules

By Anh-Vu H. Pham,Morgan J. Chen,Kunia Aihara

Cover of Substrate Integrated Antennas and Arrays by yu jian cheng

Substrate Integrated Antennas and Arrays

By Yu Jian Cheng

Cover of Influence of temperature on microelectronics and system reliability by pradeep lall

Influence of temperature on microelectronics and system reliability

By Pradeep Lall

Cover of Area Array Packaging Handbook by ken gilleo

Area Array Packaging Handbook

By Ken Gilleo

Cover of Microelectronics packaging handbook by r.r. tummala,eugene j. rymaszewski,alan g. klopfenstein

Microelectronics packaging handbook

By R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein

Cover of Advanced Thermal Management Materials by guosheng jiang

Advanced Thermal Management Materials

By Guosheng Jiang

Cover of RF and microwave microelectronics packaging by ken kuang

RF and microwave microelectronics packaging

By Ken Kuang

Cover of Quantum-well laser array packaging by jens w tomm,juan jiménez

Quantum-well laser array packaging

By Jens W Tomm,Juan Jiménez

Cover of Fundamentals of microfabrication by marc j. madou

Fundamentals of microfabrication

By Marc J. Madou

Cover of Mechanical Behavior of Materials and Structures in Microelectronics by ephraim suhir

Mechanical Behavior of Materials and Structures in Microelectronics

By Ephraim Suhir

Cover of Area Array Packaging Materials by ken gilleo

Area Array Packaging Materials

By Ken Gilleo

Cover of International Symposium on Advances in Interconnection and Packaging by international symposium on advances in interconnection and packaging (1990 boston, mass.)

International Symposium on Advances in Interconnection and Packaging

By International Symposium on Advances in Interconnection and Packaging (1990 Boston, Mass.)

Cover of MEMS packaging by tai-ran hsu

MEMS packaging

By Tai-Ran Hsu

Cover of Materials for Advanced Packaging by daniel lu

Materials for Advanced Packaging

By Daniel Lu

Cover of Multichip module technologies and alternatives by daryl ann doane,paul franzon

Multichip module technologies and alternatives

By Daryl Ann Doane,Paul Franzon

Cover of Directions for the next generation of MMIC devices and systems by henry l. bertoni

Directions for the next generation of MMIC devices and systems

By Henry L. Bertoni

Cover of Physical Design Essentials by khosrow golshan

Physical Design Essentials

By Khosrow Golshan

Cover of Failure-free integrated circuit packages by charles cohn,charles a harper,charles a. harper,charles harper

Failure-free integrated circuit packages

By Charles Cohn,Charles A Harper,Charles A. Harper,Charles Harper

Microelectronic packaging

Microelectronic packaging

By A. H. Agajanian

Proceedings of the 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing, presented at Hotel Concorde Saint-Lazare, December 12-15, 1999, Paris, France

Proceedings of the 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing, presented at Hotel Concorde Saint-Lazare, December 12-15, 1999, Paris, France

By Workshop on Polymeric Materials for Microelectronics and Photonics Applications: Mechanics, Physics, Reliability, Processing (1999 Paris, France)