Cover of Lead-free solder interconnect reliability

An edition of Lead-free solder interconnect reliability (2005)

Lead-free solder interconnect reliability

By Dongkai Shangguan

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Publish Date

2005

Publisher

ASM International

Language

eng

Pages

-

Description:

subjects: Lead-free electronics manufacturing processes, Reliability, Solder and soldering, Microelectronic packaging, Manufacturing processes, Mise sous boîtier (Microélectronique), Fiabilité, Soudure, Solder, TECHNOLOGY & ENGINEERING, Electronics, Digital, Microelectronics