Through Silicon Vias
An edition of Through Silicon Vias (2016)
By Brajesh Kumar Kaushik,Arsalan Alam,Manoj Kumar Majumder,Vobulapuram Ramesh Kumar
Publish Date
2020
Publisher
Taylor & Francis Group
Language
eng
Pages
216
Description:
subjects: Interconnected electric utility systems, Integrated circuits, Engineering, Interconnects (Integrated circuit technology), Three-dimensional integrated circuits, Interconnexions (Technologie des circuits intégrés), Circuits intégrés tridimensionnels, TECHNOLOGY & ENGINEERING, Mechanical