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three-dimensional integrated circuits

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View Physical Design for 3D Integrated Circuits By Aida Todri-Sanial,Chuan Seng Tan

Physical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits

By Aida Todri-Sanial,Chuan Seng Tan

View Through Silicon Vias By Brajesh Kumar Kaushik,Arsalan Alam,Manoj Kumar Majumder,Vobulapuram Ramesh Kumar

Through Silicon Vias

Through Silicon Vias

By Brajesh Kumar Kaushik,Arsalan Alam,Manoj Kumar Majumder,Vobulapuram Ramesh Kumar

View 3D Integration in VLSI Circuits By Katsuyuki Sakuma
Cover of 3D Integration in VLSI Circuits by katsuyuki sakuma

3D Integration in VLSI Circuits

By Katsuyuki Sakuma

View Design of 3D Integrated Circuits and Systems By Rohit Sharma

Design of 3D Integrated Circuits and Systems

Design of 3D Integrated Circuits and Systems

By Rohit Sharma

View Semiconducting Black Phosphorus By Han Zhang,Nasir Mahmood Abbasi,Bing Wang
Cover of Semiconducting Black Phosphorus by han zhang,nasir mahmood abbasi,bing wang

Semiconducting Black Phosphorus

By Han Zhang,Nasir Mahmood Abbasi,Bing Wang

View Vertical 3D Memory Technologies By Betty Prince
Cover of Vertical 3D Memory Technologies by betty prince

Vertical 3D Memory Technologies

By Betty Prince

View Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement By Yue Ma,Christian Gontrand

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

By Yue Ma,Christian Gontrand

View VLSI and Post-CMOS Electronics By Rohit Dhiman,Rajeevan Chandel
Cover of VLSI and Post-CMOS Electronics by rohit dhiman,rajeevan chandel

VLSI and Post-CMOS Electronics

By Rohit Dhiman,Rajeevan Chandel

View Three-dimensional integrated circuit design By Vasilis F. Pavlidis
Cover of Three-dimensional integrated circuit design by vasilis f. pavlidis

Three-dimensional integrated circuit design

By Vasilis F. Pavlidis

View Design and Modeling for 3D ICs and Interposers By Madhavan Swaminathan
Cover of Design and Modeling for 3D ICs and Interposers by madhavan swaminathan

Design and Modeling for 3D ICs and Interposers

By Madhavan Swaminathan

View Modelling Methodologies in Analogue Integrated Circuit Design By Günhan Dündar,Mustafa Berke Yelten

Modelling Methodologies in Analogue Integrated Circuit Design

Modelling Methodologies in Analogue Integrated Circuit Design

By Günhan Dündar,Mustafa Berke Yelten

View 3-jigen shisutemu in pakkēji to zairyō gijutsu By Tadatomo Suga

3-jigen shisutemu in pakkēji to zairyō gijutsu

3-jigen shisutemu in pakkēji to zairyō gijutsu

By Tadatomo Suga

View Stress Induced Phenomena and Reliability in 3D Microelectronics By Japan) International Workshop on Stress-Induced Phenomena in Microelectronics (12th 2012 Kyoto

Stress Induced Phenomena and Reliability in 3D Microelectronics

Stress Induced Phenomena and Reliability in 3D Microelectronics

By Japan) International Workshop on Stress-Induced Phenomena in Microelectronics (12th 2012 Kyoto

View Solid modeling applied to three-dimensional semiconductor process simulation By Marc Westermann

Solid modeling applied to three-dimensional semiconductor process simulation

Solid modeling applied to three-dimensional semiconductor process simulation

By Marc Westermann

View Three-dimensional integrated circuit layout By Andrew Harter
Cover of Three-dimensional integrated circuit layout by andrew harter

Three-dimensional integrated circuit layout

By Andrew Harter

View 3D IC Integration and Packaging By John Lau
Cover of 3D IC Integration and Packaging by john lau

3D IC Integration and Packaging

By John Lau

View Electrical modeling and design for 3D integration By Er-Ping Li
Cover of Electrical modeling and design for 3D integration by er-ping li

Electrical modeling and design for 3D integration

By Er-Ping Li

View Handbook of 3D integration By Peter Ramm
Cover of Handbook of 3D integration by peter ramm

Handbook of 3D integration

By Peter Ramm

View Shirikon kantsū denkyoku TSV By Seiichi Denda

Shirikon kantsū denkyoku TSV

Shirikon kantsū denkyoku TSV

By Seiichi Denda

View Threedimensional Integrated Circuit Design Eda Design And Microarchitectures By Yuan Xie
Cover of Threedimensional Integrated Circuit Design Eda Design And Microarchitectures by yuan xie

Threedimensional Integrated Circuit Design Eda Design And Microarchitectures

By Yuan Xie

View Throughsilicon Vias For 3d Integration By John Lau
Cover of Throughsilicon Vias For 3d Integration by john lau

Throughsilicon Vias For 3d Integration

By John Lau

View Design For High Performance Low Power And Reliable 3d Integrated Circuits By Sung Kyu Lim
Cover of Design For High Performance Low Power And Reliable 3d Integrated Circuits by sung kyu lim

Design For High Performance Low Power And Reliable 3d Integrated Circuits

By Sung Kyu Lim

View 3D IC stacking technology By Banqiu Wu,Ajay Kumar,Sesh Ramaswami

3D IC stacking technology

3D IC stacking technology

By Banqiu Wu,Ajay Kumar,Sesh Ramaswami

View Stress management for 3D ICs using through silicon vias By International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 Albany, N.Y.)

Stress management for 3D ICs using through silicon vias

Stress management for 3D ICs using through silicon vias

By International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 Albany, N.Y.)