1-24 of 24 Books
Physical Design for 3D Integrated Circuits
Physical Design for 3D Integrated Circuits
By Aida Todri-Sanial,Chuan Seng Tan
Through Silicon Vias
Through Silicon Vias
By Brajesh Kumar Kaushik,Arsalan Alam,Manoj Kumar Majumder,Vobulapuram Ramesh Kumar

3D Integration in VLSI Circuits
By Katsuyuki Sakuma
Design of 3D Integrated Circuits and Systems
Design of 3D Integrated Circuits and Systems
By Rohit Sharma

Semiconducting Black Phosphorus
By Han Zhang,Nasir Mahmood Abbasi,Bing Wang
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
By Yue Ma,Christian Gontrand

VLSI and Post-CMOS Electronics
By Rohit Dhiman,Rajeevan Chandel

Three-dimensional integrated circuit design
By Vasilis F. Pavlidis

Design and Modeling for 3D ICs and Interposers
By Madhavan Swaminathan
Modelling Methodologies in Analogue Integrated Circuit Design
Modelling Methodologies in Analogue Integrated Circuit Design
By Günhan Dündar,Mustafa Berke Yelten
3-jigen shisutemu in pakkēji to zairyō gijutsu
3-jigen shisutemu in pakkēji to zairyō gijutsu
By Tadatomo Suga
Stress Induced Phenomena and Reliability in 3D Microelectronics
Stress Induced Phenomena and Reliability in 3D Microelectronics
By Japan) International Workshop on Stress-Induced Phenomena in Microelectronics (12th 2012 Kyoto
Solid modeling applied to three-dimensional semiconductor process simulation
Solid modeling applied to three-dimensional semiconductor process simulation
By Marc Westermann

Three-dimensional integrated circuit layout
By Andrew Harter

Electrical modeling and design for 3D integration
By Er-Ping Li
Shirikon kantsū denkyoku TSV
Shirikon kantsū denkyoku TSV
By Seiichi Denda

Threedimensional Integrated Circuit Design Eda Design And Microarchitectures
By Yuan Xie

Throughsilicon Vias For 3d Integration
By John Lau

Design For High Performance Low Power And Reliable 3d Integrated Circuits
By Sung Kyu Lim
3D IC stacking technology
3D IC stacking technology
By Banqiu Wu,Ajay Kumar,Sesh Ramaswami
Stress management for 3D ICs using through silicon vias
Stress management for 3D ICs using through silicon vias
By International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 Albany, N.Y.)