An edition of Proceedings of the Symposium on Interconnect and Contact Metallization (1998)
By Symposium on Interconnect and Contact Metallization (1997 Paris, France)
Publish Date
1998
Publisher
Electrochemical Society
Language
eng
Pages
276
Description:
subjects: Congresses, Integrated circuits, Ultra large scale integration, Dielectrics, Electrochemical metallizing, Design and construction, Materials, Plasma-enhanced chemical vapor deposition