Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

An edition of Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement (2019)

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

By Yue Ma,Christian Gontrand

0 (0 Ratings)

0 Want to read0 Currently reading0 Have read

Publish Date

2019

Publisher

Taylor & Francis Group

Language

eng

Pages

226

Description:

subjects: Integrated circuits, Three-dimensional integrated circuits, Circuits intégrés tridimensionnels, TECHNOLOGY & ENGINEERING, Mechanical, COMPUTERS, Networking, General, TECHNOLOGY, Electricity, Electronics, Circuits