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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

By Juan Cepeda-Rizo,Jeremiah Gayle,Joshua Ravich

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Publish Date

2021

Publisher

Taylor & Francis Group

Language

eng

Pages

256

Description:

subjects: Electronic packaging,  Electronic apparatus and appliances,  Reliability,  Space vehicles,  Electronic equipment,  Design and construction,  Extreme environments,  Mise sous boîtier (Électronique),  Appareils électroniques,  Fiabilité,  Milieux extrêmes,  TECHNOLOGY / Engineering / Civil,  TECHNOLOGY / Engineering / Mechanical