Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

An edition of Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (2021)

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

By Juan Cepeda-Rizo,Jeremiah Gayle,Joshua Ravich

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Publish Date

2021

Publisher

Taylor & Francis Group

Language

eng

Pages

256

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