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Wafer scale integration, III

proceedings of the Third IFIP WG 10.5 Workshop on Wafer Scale Integration, Como, Italy, 6-8 June 1989

By IFIP WG 10.5 Workshop on Wafer Scale Integration (3rd 1989 Como, Italy)

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Publish Date

1990

Publisher

North-Holland,Distributors for the U.S. and Canada, Elsevier Science Pub. Co.

Language

eng

Pages

402

Description:

subjects: Congresses,  Integrated circuits,  Wafer scale integration,  Wafer-scale integration