Chemical mechanical planarization V

proceedings of the International Symposium

By International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (5th 2002 Philadelphia, Pa.)

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Publish Date

2002

Publisher

Electrochemical Society, Inc.

Language

eng

Pages

274

Description:

subjects: Congresses, Grinding and polishing, Integrated circuits, Materials, Metals, Microelectronics, Pickling, Chemical mechanical planarization