An edition of Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II (2003)
Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II
proceedings of the international symposium
By International Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics II (2003 Orlando, Fla.)
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Publish Date
2003
Publisher
Electrochemical Society
Language
eng
Pages
276
Description:
subjects: Congresses, Copper, Dielectric films, Electroplating, Integrated circuits, Materials