1-24 of 42 Books

Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics--2004
By R. J. Carter
![Cover of Silicon nitride, silicon dioxide thin insulating films, and other emerging diele[c]trics VIII by symposium on silicon nitride and silicon dioxide thin insulating films (8th 2005 québec, québec)](https://covers.openlibrary.org/b/id/5424066-M.jpg)
Silicon nitride, silicon dioxide thin insulating films, and other emerging diele[c]trics VIII
By Symposium on Silicon Nitride and Silicon Dioxide Thin Insulating Films (8th 2005 Québec, Québec)
Materials, technology and reliability of low-k dielectrics and copper interconnects
Materials, technology and reliability of low-k dielectrics and copper interconnects
By Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.)

Dielectric films for advanced microelectronics
By Mikhail Baklanov,Martin Green,Karen Maex
Amorphous and Crystalline Insulating Thin Films--1996
Amorphous and Crystalline Insulating Thin Films--1996
By William L. Warren

The Classical And Quantum Dynamics Of The Multispherical Nanostructures
By Gennadiy Burlak
Dielectric Layers in Semiconductors
Dielectric Layers in Semiconductors
By G. G. Bentine

Materials, technology and reliability for advanced interconnects and low-k dielectrics, 2003
By Symposim E, "Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics" (2003 San Francisco, Calif.)

Stress-induced phenomena in metallization
By International Workshop on Stress-Induced Phenomena in Metallization (7th 2004 Austin, Tex.)

Materials, technology and reliability for advanced interconnects and low-k dielectrics
By Karen Maex

Structure and electronic properties of ultrathin dielectric films on silicon and related structures
By D. A. Buchanan
Silicon nitride, silicon dioxide, and emerging dielectrics 9
Silicon nitride, silicon dioxide, and emerging dielectrics 9
By Symposium on Silicon Nitride, Silicon Dioxide Thin Insulating Films, and Emerging Dielectrics (9th 2007 Chicago, Ill.)

Materials, technology and reliability for advanced interconnects--2005
By Paul R. Besser,C. P. Wong
Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects
Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects
By Ting Y. Tsui
Testing and failure analysis to improve screening techniques for hermetically sealed metallized film capacitors for low energy applications
Testing and failure analysis to improve screening techniques for hermetically sealed metallized film capacitors for low energy applications
By

Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II
By International Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics II (2003 Orlando, Fla.)

Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics
By Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics (2000 Phoenix, Ariz.)
Dielectric films on gallium arsenide
Dielectric films on gallium arsenide
By W. F. Croydon

Dielectrics in emerging technologies
By International Symposium on Science and Technology of Dielectrics in Emerging Fields (1st 2003 Paris, France)
Proceedings of the Symposium on Dielectric Films on Compound Semiconductors
Proceedings of the Symposium on Dielectric Films on Compound Semiconductors
By Symposium on Dielectric Films on Compound Semiconductors (1985 Las Vegas, Nev.)
Proceedings of the Symposium on Dielectric Films on Compound Semiconductors
Proceedings of the Symposium on Dielectric Films on Compound Semiconductors
By Symposium on Dielectric Films on Compound Semiconductors (1987 Honolulu, Hawaii)

Process, equipment, and materials control in integrated circuit manufacturing
By Anant G. Sabnis

Microelectronics technology and process integration
By S. P. Murarka