An edition of Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics (2001)
Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics
proceedings of the international symposium
By Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics (2000 Phoenix, Ariz.)
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Publish Date
2001
Publisher
Electrochemical Society
Language
eng
Pages
224
Description:
subjects: Congresses, Copper, Dielectric films, Electroplating, Integrated circuits, Materials