An edition of Cae - CAD Application to Electronic Packaging (1994)
CAE/CAD application to electronic packaging
presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
By D. Agonafer
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Publish Date
1994
Publisher
American Society of Mechanical Engineers
Language
eng
Pages
89
Description:
subjects: Heat sinks (Electronics), Congresses, Electronic packaging