An edition of Cae - CAD Application to Electronic Packaging (1994)
CAE/CAD application to electronic packaging
presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
By D. Agonafer
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Publish Date
1994
Publisher
American Society of Mechanical Engineers
Language
eng
Pages
89
1-3 of 3 Editions
CAE/CAD application to electronic packagingpresented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
Language: eng
Pages: 89
Published In: 1994
Publisher: American Society of Mechanical Engineers
CAE/CAD application to electronic packagingpresented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
Language: eng
Pages: 89
Published In: 1994
Publisher: American Society of Mechanical Engineers
Cae - CAD Application to Electronic Packaging1994 International Mechanical Engineering Congress & Exposition, Chicago, Illinois - November 6-11, 199 (Eep -)
Language: eng
Pages: 96
Published In: December 1994
Publisher: American Society of Mechanical Engineers