Advances in Chemical Mechanical Planarization (CMP)

An edition of Advances in Chemical Mechanical Planarization (CMP) (2016)

Advances in Chemical Mechanical Planarization (CMP)

By Suryadevara Babu

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Publish Date

2016

Publisher

Elsevier Science & Technology

Language

eng

Pages

536

Description:

subjects: Semiconductors, Grinding and polishing, Chemical mechanical planarization, Nanoelectronics, Microelectronics, Miniaturization, Planarisation chimicomécanique, Nanoélectronique, Microélectronique, TECHNOLOGY & ENGINEERING, Mechanical