

An edition of Influence of temperature on microelectronics and system reliability (1997)
A Physics of Failure Approach
By Pradeep Lall
Publish Date
2020
Publisher
Taylor & Francis Group
Language
eng
Pages
336
Description:
subjects: Reliability, Electronic apparatus and appliances, Materials, Microelectronics, Thermal properties, Electronic packaging, Microelectronic packaging, Microélectronique, Matériaux, Propriétés thermiques, Mise sous boîtier (Microélectronique), Appareils électroniques, Fiabilité, TECHNOLOGY, Electricity