Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects

An edition of Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects (2006)

Materials, technology and reliability of low-k dielectrics and copper interconnects

symposium held April 18-21, 2006, San Francisco, California, U.S.A.

By Ting Y. Tsui

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Publish Date

2006

Publisher

Materials Research Society

Language

eng

Pages

462

Description:

subjects: Semiconductors, Materials, Congresses, Junctions, Dielectric films, Integrated circuits, Reliability